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PEM® surface mounted standoffs that eliminate the need for attaching screws

PEM® SMTSK™ standoffs are designed so that a PC board or panel can be quickly slipped into place and then removed from an assembly by simply sliding the board sideways and lifting it off. These standoffs mount on PC Boards in the same manner and at the same time as other surface mount components prior to the automated reflow solder process.

  • Reduces scrap, handling and risk of board damage.
  • Unique barrel design allowsmore
    • Unit of Measure

    L - Length ± .005

    		 .125 in
    SMTSK-2.jpg

    Min. Sheet Thickness

    		 .060 in

    A Max.

    		 .060 in

    C Max.

    		 .161 in

    E ± .005

    		 .250 in

    B ± .003

    		 .177 in

    P ± .003

    		 .099 in

    R Max.

    		 .212 in

    S ± .003

    		 .068 in

    M Max.

    		 .108 in

    øH - Hole Size in Sheet + .003 - .000

    		 .166 in

    øD - Min. Solder Pad

    		 .276 in
    Parts per Reel1 630

    Fastener Material

    		 Carbon Steel
    Standard Finish2 Electro-plated tin ASTM B 545, Class B with clear preservative coating, annealed

    Bottom Mounting Hole B + .003 -.000

    		 .166 in

    Min. Thickness - Panel 1 (Bottom)

    		 .060 in

    Thickness Range - Panel 2 (Top)

    		 .057 to .064 in

    Material - Panel 1 (Bottom)

    		 PC Board

    Material - Panel 2 (Top)

    		 ANY

    Edge Distance C2 Min.

    		 .160 in

    Location Tolerance

    		 ±.005 in

    Max. Hardness - Panel 1 (Bottom)

    		 No Limit

    Max. Hardness - Panel 2 (Top)

    		 No Limit

    CAD Supplier

    		 PennEngineering® (PEM®)
    • 1 Packaged on 13" recyclable reels. Tape width is 24mm and 16mm. Pitch is 16mm and 12mm. Reels conform to EIA-481.
    • 2 (1) See PEM® Technical Support section of our website for related plating standards and specifications.
      (2) Optimal solderability life noted on package.
      (3) The tin deposit on SMTSK standoffs meet the requirements of ASTM B545, Class A and although the copper and nickel barrier layers used under the tin do not strictly comply with ASTM B545 thickness requirements they have proven effective at preventing zinc migration and providing the specified solderable shelf life.