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PEM® Brand Fasteners for Metal Sheets and Panels
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Fasteners for Mounting into Printed Circuit Boards
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Nuts and Spacers/Standoffs, Surface Mount – Types SMTSO, SMTSOB, SMTSS™, SMTSK™, SMTBSO™
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REELFAST® KEYHOLE® Standoffs – Type SMTSK™ - Unified
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Part # SMTSK-6060-4 ET
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Part # SMTSK-6060-4 ET, SMTSK™ REELFAST® KEYHOLE® Standoffs - Unified
PEM® surface mounted standoffs that eliminate the need for attaching screws
PEM® SMTSK™ standoffs are designed so that a PC board or panel can be quickly slipped into place and then removed from an assembly by simply sliding the board sideways and lifting it off. These standoffs mount on PC Boards in the same manner and at the same time as other surface mount components prior to the automated reflow solder process.
Reduces scrap, handling and risk of board damage.
Unique barrel design allows for quick attachment and detachment.
Makes horizontal or vertical component mounting possible.
Provided on tape and reel compatible with existing SMT automated installation equipment.
larger image
larger image
Specifications
L - Length ± .005
.125
in
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Min. Sheet Thickness
.060
in
A Max.
.060
in
C Max.
.161
in
E ± .005
.250
in
B ± .003
.177
in
P ± .003
.099
in
R Max.
.212
in
S ± .003
.068
in
M Max.
.108
in
øH - Hole Size in Sheet + .003 - .000
.166
in
øD - Min. Solder Pad
.276
in
Parts per Reel
1
630
Fastener Material
Carbon Steel
Standard Finish
2
Electro-plated tin ASTM B 545, Class B with clear preservative coating, annealed
Bottom Mounting Hole B + .003 -.000
.166
in
Min. Thickness - Panel 1 (Bottom)
.060
in
Thickness Range - Panel 2 (Top)
.057 to .064
in
Material - Panel 1 (Bottom)
PC Board
Material - Panel 2 (Top)
ANY
Edge Distance C2 Min.
.160
in
Location Tolerance
±.005
in
Max. Hardness - Panel 1 (Bottom)
No Limit
Max. Hardness - Panel 2 (Top)
No Limit
CAD Supplier
PennEngineering® (PEM®)
1
Packaged on 13" recyclable reels. Tape width is 24mm and 16mm. Pitch is 16mm and 12mm. Reels conform to EIA-481.
2
(1) See PEM® Technical Support section of our website for related plating standards and specifications.
(2) Optimal solderability life noted on package.
(3) The tin deposit on SMTSK standoffs meet the requirements of ASTM B545, Class A and although the copper and nickel barrier layers used under the tin do not strictly comply with ASTM B545 thickness requirements they have proven effective at preventing zinc migration and providing the specified solderable shelf life.
VIEW CAD DRAWING
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3D
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2D Front View
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2D Sales Drawing
DOWNLOADS
PEM Bulletin SMTSK™
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