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N/AElectro-Plated Tin, ASTM B 545, Class A with Clear Preservative Coating, annealed
CAD Supplier
N/APennEngineering® (PEM®)
1 The tin deposit on type SMTSOB meets the requirements of ASTM B545, Class A and although the copper and nickel barrier layers used under the tin do not strictly comply with ASTM B545 thickness requirements they have proven effective at preventing zinc migration and providing the specified solderable shelf life.
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